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| SUPPLEMENT Am29F010 Known Good Die 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory--Die Revision 1 DISTINCTIVE CHARACTERISTICS s Single power supply operation -- 5.0 V 10% for read, erase, and program operations -- Simplifies system-level power requirements s High performance -- 90 or 120 ns maximum access time s Low power consumption -- 30 mA max active read current -- 50 mA max program/erase current -- <25 A typical standby current s Flexible sector architecture -- Eight uniform sectors -- Any combination of sectors can be erased -- Supports full chip erase s Sector protection -- Hardware-based feature that disables/reenables program and erase operations in any combination of sectors -- Sector protection/unprotection can be implemented using standard PROM programming equipment s Embedded Algorithms -- Embedded Erase algorithm automatically pre-programs and erases the chip or any combination of designated sector -- Embedded Program algorithm automatically programs and verifies data at specified address s Minimum 100,000 program/erase cycles guaranteed s Compatible with JEDEC standards -- Pinout and software compatible with single-power-supply flash -- Superior inadvertent write protection s Data Polling and Toggle Bits -- Provides a software method of detecting program or erase cycle completion s Tested to datasheet specifications at temperature s Quality and reliability levels equivalent to standard packaged components 1/13/98 Publication# 21116 Rev: B Amendment/0 Issue Date: January 1998 SUPPLEMENT GENERAL DESCRIPTION The Am29F010 in Known Good Die (KGD) form is a 1 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form. Am29F010 Features The Am29F010 device is organized as eight uniform sectors of 16 Kbytes each for flexible erase capability. This device is designed to be programmed in-system with the standard system 5.0 Volt V CC supply. A power supply providing 12.0 Volt V PP is not required for program or erase operations. The Am29F010 in KGD form offers access times of 90 ns and 120 ns, allowing high speed microprocessors to operate without wait states. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE) controls. The device requires only a single 5.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by executing the program command sequence. This invokes the Embedded Program algorithm--an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Device erasure occurs by executing the erase command sequence. This invokes the Embedded Erase algorithm--an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The host system can detect whether a program or erase operation is complete by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is erased when shipped from the factory. The hardware data protection measures include a low VCC detector automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory, and is implemented using standard EPROM programmers. The system can place the device into the standby mode. Power consumption is greatly reduced in this mode. ELECTRICAL SPECIFICATIONS Refer to the Am29F010 data sheet, publication number 16736, for full electri cal specifications for the Am29F010 in KGD form. 2 Am29F010 Known Good Die 1/13/98 SUPPLEMENT PRODUCT SELECTOR GUIDE Family Part Number Speed Option (VCC = 5.0 V 10%) Max Access Time, tACC (ns) Max CE# Access, tCE (ns) Max OE# Access, tOE (ns) -90 90 90 35 Am29F010 KGD -120 120 120 50 DIE PHOTOGRAPH Orientation relative to top left corner of Gel-Pak Orientation relative to leading edge of tape and reel DIE PAD LOCATIONS 76 543 2 1 30 29 28 27 26 8 25 AMD logo location 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1/13/98 Am29F010 Known Good Die 3 SUPPLEMENT PAD DESCRIPTION Pad Center (mils) Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Signal X VCC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 VSS D3 D4 D5 D6 D7 CE# A10 OE# A11 A9 A8 A13 A14 WE# 0.00 -33.20 -41.60 -49.90 -58.30 -66.60 -75.00 -74.40 -75.60 -69.40 -56.10 -46.10 -36.30 -25.90 -13.30 -4.30 4.70 17.30 27.60 40.20 50.60 60.60 74.00 81.40 80.20 80.80 72.40 64.10 55.70 47.40 Y 0.00 -1.30 -1.30 -1.30 -1.30 -1.30 -1.30 -10.50 -158.20 -166.80 -166.80 -166.80 -166.90 -166.90 -166.90 -166.90 -166.90 -166.90 -166.90 -166.90 -166.90 -166.80 -166.80 -158.20 -10.40 -1.30 -1.30 -1.30 -1.30 -1.30 X 0.00 -0.84 -1.06 -1.27 -1.48 -1.69 -1.91 -1.89 -1.92 -1.76 -1.42 -1.17 -0.92 -0.66 -0.34 -0.11 0.12 0.44 0.70 1.02 1.29 1.54 1.88 2.07 2.04 2.05 1.84 1.63 1.41 1.20 Y 0.00 -0.03 -0.03 -0.03 -0.03 -0.03 -0.03 -0.27 -4.02 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.24 -4.02 -0.26 -0.03 -0.03 -0.03 -0.03 -0.03 Pad Center (millimeters) Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment. 4 Am29F010 Known Good Die 1/13/98 SUPPLEMENT ORDERING INFORMATION Standard Products AMD KGD products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29F010 -90 DP C 1 DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document. It is entered in the revision field of AMD standard product nomenclature. TEMPERATURE RANGE C = Commercial (0C to +70C) I = Industrial (-40C to +85C) E = Extended (-55C to +125C) PACKAGE TYPE AND MINIMUM ORDER QUANTITY DP = Waffle Pack 245 die per 5 tray stack DG = DT = DW = Gel-Pak(R) Die Tray 486 die per 6 tray stack SurftapeTM (Tape and Reel) 2500 per 7-inch reel Gel-Pak(R) Wafer Tray (sawn wafer on frame) Call AMD sales office for minimum order quantity SPEED OPTION See Valid Combinations DEVICE NUMBER/DESCRIPTION Am29F010 Known Good Die 1 Megabit (128 K x 8-Bit) CMOS Flash Memory--Die Revision 1 5.0 Volt-only Program and Erase Valid Combinations Am29F010-90 AM29F010-120 DPC 1, DPI 1, DPE 1, DGC 1, DGI 1, DGE 1, DTC 1, DTI 1, DTE 1, DWC 1, DWI 1, DWE 1 Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. 1/13/98 Am29F010 Known Good Die 5 SUPPLEMENT PRODUCT TEST FLOW Figure 1 provides an overview of AMD's Known Good Die test flow. For more detailed information, refer to the Am29F010 product qualification database supplement for KGD. AMD implements quality assurance procedures throughout the product test flow. In addition, an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. Wafer Sort 1 DC Parameters Functionality Programmability Erasability Bake 24 hours at 250C Data Retention Wafer Sort 2 DC Parameters Functionality Programmability Erasability Wafer Sort 3 High Temperature DC Parameters Functionality Programmability Erasability Speed Packaging for Shipment Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack Shipment Figure 1. AMD KGD Product Test Flow 6 Am29F010 Known Good Die 1/13/98 SUPPLEMENT PHYSICAL SPECIFICATIONS Die dimensions . . . . . . . . . . . . . . 174 mils x 189 mils 4.42 mm x 4.80 mm Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm Bond Pad Size . . . . . . . . . . . . . . 4.47 mils x 4.47 mils 113.48 m x 113.48 m Pad Area Free of Passivation . . . . . . . . . .19.98 mils2 12,878 m2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride MANUFACTURING INFORMATION Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX Manufacturing ID. . . . . . . . . . . . . . . . . . . . . . 98108AK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SPECIAL HANDLING INSTRUCTIONS Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage Store at a maximum temperature of 30C in a nitrogenpurged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. DC OPERATING CONDITIONS VCC (Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V Junction Temperature Under Bias . .TJ (max) = 130C For Read-only . . . . . . . . . . .TJ (max) = 140C Operating Temperature . . . Commercial 0C to +70C Industrial -40C to +85C Extended -55C to +125C 1/13/98 Am29F010 Known Good Die 7 SUPPLEMENT TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to AMD Products under this agreement shall be subject to AMD's standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right to make at any time and from time to time. In the event of conflict between the provisions of AMD's standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling. AMD warrants articles of its manufacture against defective materials or workmanship for a period of ninety (90) days from date of shipment. This warranty does not extend beyond AMD's customer, and does not extend to die which has been affixed onto a board or substrate of any kind. The liability of AMD under this warranty is limited, at AMD's option, solely to repair or to replacement with equivalent articles, or to make an appropriate credit adjustment not to exceed the original sales price, for articles returned to AMD, provided that: (a) The Buyer promptly notifies AMD in writing of each and every defect or nonconformity in any article for which Buyer wishes to make a warranty claim against AMD; (b) Buyer obtains authorization from AMD to return the article; (c) the article is returned to AMD, transportation charges paid by AMD, F.O.B. AMD's factory; and (d) AMD's examination of such article discloses to its satisfaction that such alleged defect or nonconformity actually exists and was not caused by negligence, misuse, improper installation, accident or unauthorized repair or alteration by an entity other than AMD. The aforementioned provisions do not extend the original warranty period of any article which has either been repaired or replaced by AMD. THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD'S PART, AND IT NEITHER ASSUMES NOR AUTHORIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES. THE FOREGOING CONSTITUTES THE BUYERS SOLE AND EXCLUSIVE REMEDY FOR THE FURNISHING OF DEFECTIVE OR NON CONFORMING ARTICLES AND AMD S HA LL N OT IN AN Y EV EN T BE LIAB LE FOR DAMAGES BY REASON OF FAILURE OF ANY PRODUCT TO FUNCTION PROPERLY OR FOR ANY SPECIAL, INDIRECT, CONSEQUENTIAL, INCIDENTAL OR EXEMPLARY DAMAGES, INCLUDING BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS OF USE OR COST OF LABOR BY REASON OF THE FACT THAT SUCH ARTICLES SHALL HAVE BEEN DEFECTIVE OR NON CONFORMING. Buyer agrees that it will make no warranty representations to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD's warranty. Buyer assumes all responsibility for successful die prep, die attach and wire bonding processes. Due to the unprotected nature of the AMD Products which are the subject hereof, AMD assumes no responsibility for environmental effects on die. AMD products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in a personal injury. Buyer's use of AMD products for use in life support applications is at Buyer's own risk and Buyer agrees to fully indemnify AMD for any damages resulting in such use or sale. REVISION SUMMARY FOR AM29F010 KNOWN GOOD DIE Formatted to match current template. Updated Distinctive Characteristics and General Description sections using the current main data sheet. Trademarks Copyright (c) 1998 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. 8 Am29F010 Known Good Die 1/13/98 |
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